发明名称 LIGHT-EMITTING DIODE SUBSTRATE
摘要 PURPOSE:To dissipate heat easily from a light-emitting diode concentrically mounted with high density by forming a light-emitting diode placing section on the surface, forming a black ceramic layer on the back side and laminating a conductor layer on the black ceramic layer. CONSTITUTION:A light-emitting diode placing section 2 consisting of a band- shaped conductor is shaped at the central section of the surface of a light- emitting diode substrate 1. A light-emitting diode 3 with P-N junctions 3 aligned and arranged on a straight line is fixed onto the light-emitting diode placing section 2 with conductive adhesives 4, and wirings are wired to wire bonding pads 5 shaped near the light-emitting diode by metallic small wires 6. The light- emitting diode substrate 1 is formed in laminated structure in which the surface side consists of a wiring layer 1a using white ceramics as a substrate, the intermediate side a black ceramic layer 1b and the back side a conductor layer 1c. A support board 8 combining a radiator plate is fixed on the back by an adhesive layer 7.
申请公布号 JPS59214279(A) 申请公布日期 1984.12.04
申请号 JP19830089503 申请日期 1983.05.20
申请人 SANYO DENKI KK;TOTSUTORI SANYOU DENKI KK 发明人 SAKAGUCHI SHIGERU
分类号 H01L33/30;H01L33/62;H01L33/64 主分类号 H01L33/30
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