发明名称 |
Palladium plating prodedure |
摘要 |
A palladium electroplating procedure is disclosed which permits rapid and efficient plating and yields ductile, adherent palladium films. The electroplating bath comprises a unique palladium complex. The procedure is also useful for electroplating a variety of palladium alloys. In addition, the bath is highly stable and does not adversely affect the base material being plated.
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申请公布号 |
US4486274(A) |
申请公布日期 |
1984.12.04 |
申请号 |
US19830477588 |
申请日期 |
1983.03.21 |
申请人 |
AT&T BELL LABORATORIES |
发明人 |
ABYS, JOSEPH A.;TROP, HARVEY S. |
分类号 |
C25D3/52;(IPC1-7):C25D3/52;C25D3/56;C25D3/58;C25D3/64 |
主分类号 |
C25D3/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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