发明名称 ULTRAVIOLET-CURING SOLDER RESIST INK
摘要 <p>PURPOSE:To provide the titled ink having high rate of cure on a copper plate, and giving a cured film having high hardness, by using specific amounts of a specific epoxy resin, a mixture of 2-hydroxyethyl (meth)acrylate and a polyfunctional (meth)acrylate, etc. as essential components. CONSTITUTION:The objective ink contains (A) 10-50pts.wt. of an epoxy resin composed of an epoxy-containing diacrylate compound of bisphenol A and/or novolac and having a molecular weight of 400-2,500, (B) 10-60pts.wt. of a reactive monomer mixture consisting of (i) 2-hydroxyethyl (meth)acrylate and (ii) a polyfunctional (meth)acrylate, (C) 1-8pts.wt. of a photosensitizer composed of a mixture of benzophenone and an aromatic tertiary amine wherein the weight ratio of benzophenone/tertiary amine is 0.5-2.0, and (D) 10-50pts.wt. of talc and/or calcium carbonate as fillers. The compound (ii) of the component (B) is preferably a trifunctional acrylate, and the weight ratio of i/ii is preferably 0.5-1.0.</p>
申请公布号 JPS59213780(A) 申请公布日期 1984.12.03
申请号 JP19830073004 申请日期 1983.04.27
申请人 MEIDENSHA KK 发明人 FUSHIMI KAZUO;ICHIKAWA MASAHIDE;TSUNAKAWA KOUICHI
分类号 C09D11/00;C09D11/033;C09D11/10;C09D11/101;C09D11/102;G03F7/027;H05K3/28 主分类号 C09D11/00
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