| 摘要 |
PURPOSE:To subject the inside of the recessed groove of an electronic part to efficient partial plating with high quality by rotating anode cylindrical bodies in contact with the recessed groove of the material to be treated while dipping the lower half surfaces of the cylindrical bodies into a circulating plating soln. and renewing the plating soln. on the surfaces. CONSTITUTION:Anode cylindrical bodies 5, 5 are juxtaposed and pivotally supported in parallel with each other in an inside cell 4 and a plating soln. 10 is forced into the cell 4 in a way as to overflow from a discharging port 14 provided at a specified level line so that the plating soln. is circulated between said cell and a control tank through an outside cell 3. A part of the bottom surfaces of the bodies 5 are dipped in the soln. to renew the plating soln. on the circumferential surfaces of the bodies 5 at all times. A material 1 to be treated such as a connector of an electronic part, etc. is passed between the bodies 5 and 5, and the bodies 5, 5 are rotated toward the recessed groove 2 of the material 1 in contact therewith. The inside of the groove 2 is partially plated by the thin plating soln. film on the surfaces of the bodies 5. The inside of the groove of the material 1 is thus partially plated with high quality by the above-mentioned method.
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