| 摘要 |
PURPOSE:To obtain a DHD type semiconductor device having ready manufacture and high reliability by bonding both ends of a semiconductor pellet through a solder to a raised metal terminal, and hermetically sealing with epoxy resin. CONSTITUTION:A solder plating is formed on a carbon bonding jig to insert a raised metal terminal 14, a semiconductor pellet 11 and a raised metal terminal 13 are placed, heated in a melting furnace, and the pellet 11 is moten and connected through the solder between the terminals 13 and 14. Then, it is airtightly sealed with epoxy resin 12 by a resin molding sealing machine, thereby obtaining a leadless semiconductor device. Since the pellet is connected through the solder between the terminals, an open circuit and loose connection do not occur. Since resin is molded, no crack occurs due to thermal impact, and highly reliable connecting strength can be obtained even in a redip molding of HIC. |
