| 摘要 |
PURPOSE:To provide a resin compsn. which is moisture resistant, excellent in heat resistance and mechanical characteristics, and suitable for use in sealing diodes, etc., containing an epoxy resin, poly-p-hydroxystyrene and a specified quantity of an inorg. filler. CONSTITUTION:An epoxy resin (A), poly-p-hydroxystyrene (B) of the formula (wherein n is 3 or greater) and 20-90wt% (based on the weight of compsn.) inorg. filler (C) are mixed together in cush a proportion as to give a molar ratio of epoxy group of component A to phenolic hydroxyl group of component B of 0.1-10, thus obtaining the desired sealing resin ompsn. Pref. silica powder, alumina powder, antimoney trioxide, calcium carbonate or glass fiber is used as component D. Optionally, wax, parting agent, flame retarder, colorant, etc. may be added.
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