Device for picking up printed circuit boards by means of a holding frame

摘要

The holding frame has longitudinal and transverse dimensions which are larger than the largest printed circuit board to be picked up and supports, between two mutually opposite edge strips (1, 2), thin pins (11) which are aligned parallel to one another and are not soft-solderable and on which slotted holding bodies (12) can be mounted; areas of a printed circuit board inserted in the holding frame which do not have any soldering points rest on the holding bodies (12). The novel device is used, in particular, for soldering printed circuit boards (Fig. 1). <IMAGE>