| 摘要 |
PURPOSE:To measure in pair the integrated circuit characteristic and simplify the measuring procedures by forming a plurality of integrated circuits on a semiconductor substrate and making in contact with each other the integrated circuit at the rotating position in the specified angle to the reference integrated circuit with the two and more circuits formed as a pair. CONSTITUTION:Integrated circuits 13-18 are formed on a semiconductor substrate, the circuit 13 is considered as the reference integrated circuit, the circuit 14 is located at the position rotated by 270 deg. in the right side from the circuit 13 and the circuit 15 is located at the position rotated by 180 deg. in the right side. Moreover, the circuit 16 is rotated by 180 deg. in the right side and the circuit 17 is rotated by 90 deg. in the right side, the circuit 18 is located in the same direction as the circuit 13, the circuits 13-18 are placed in contact each other so that the measuring electrode terminal is located at the external circumference. Two or more pairs are formed by the circuits 13-18, the measuring terminal of the integrated circuits forming the pair is formed at the specified side, the integrated circuit characteristics are measured simultaneously in pair in order to simplify the measuring operations. |
