| 摘要 |
PURPOSE:To prevent the deterioration of characteristics due to static electricity of a semiconductor device by grasping a semiconductor vessel by a holder for assembly with a spring-shaped projecting section and executing an assembly process. CONSTITUTION:With a holder 11 for assembly, an opening section 12 is formed in a predetermined region at a central section, and a spring-shaped projecting section 13 is formed on both left and right sides of the central recessed section. When a semiconductor device is manufactured by using the holder 11 for assembly, a lead-less type semiconductor vessel 1 is inserted to the central recessed section by utilizing spring force between the spring-shaped projecting sections 13 on both left and right sides. Accordingly, when a support plate 14 is charged to a normal manufacturing facility under the state in which the lead-less type semiconductor vessel 1 is held and mounted to the holder 11 for assembly, and passed through assembly processes, such as a die bonder, a wire bonder, sealing, the putting of a seal, etc. in succession and the semiconductor device is manufactured, hands are not in contact directly with the semiconductor vessel 1, and the deterioration of a semiconductor element 3 due to static electricity or its breakdown is prevented while also facilitating handling. |
