| 摘要 |
PURPOSE:To obtain a semiconductor device, an external lead therein as a stopper on mounting need not be shaped and processed, by forming an orthogonal projection on its midway of the external lead section. CONSTITUTION:A tie bar section 2 is formed previously to external leads 1 in a lead frame in a semiconductor device molded and sealed with epoxy resin 3, etc. besides a resin seal section, and each external lead 1 is connected previously. The semiconductor device with a stopper on mounting is obtained by cutting and leaving one parts of the tie bar section 2 as projections orthogonal to the external leads 1. When the external leads 1 are inserted and mounted into the holes of a printed substrate, etc. in the semiconductor device, the tie bar sections 2 function as the stoppers, and the resin seal section is not in contact with the printed substrate, etc. |
