| 摘要 |
PURPOSE:To use even materials except solder as bump materials by bonding a semiconductor element with a substrate while being given an ultrasonic vibration. CONSTITUTION:A face-down bonded semiconductor element 6 is sucked into the opening section 5 of the lower surface of a vacuum suction nozzle 4 under vacuum, and positioned so that bump materials 7 for the semiconductor element 6 are positioned at the position of bonding of a substrate 9. When an ultrasonic vibration from a vibrator 1 is transmitted over the semiconductor element 6 through a horn 2 and the vacuum suction nozzle 4 under the state, the bump materials 7 for said semiconductor element 6 are bonded at the predetermined position of bonding by the ultrasonic vibration action. Accordingly, the semiconductor element 6 is face-down bonded on the substrate 9 through the bump materials 7. Materials, such as aluminum, gold, copper, etc. are also used besides solder as a material for the bump materials. |
