| 摘要 |
PCT No. PCT/EP82/00241 Sec. 371 Date Jun. 23, 1983 Sec. 102(e) Date Jun. 23, 1983 PCT Filed Nov. 10, 1982 PCT Pub. No. WO83/01886 PCT Pub. Date May 26, 1983.A method is proposed for through-contacting a circuit board (17), in which the wall (15) of a bore (16) is provided with a metallizing of a conductive thick-film paste (12). The application of the metallizing is effected in a particularly advantageous manner by imprinting the electrically conductive paste (12) by means of an elastically deformable imprinting stamp (11, 12).
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