| 摘要 |
PURPOSE:To obtain a semiconductor device package which is excellent in heat radiation and suitable for automated manufacturing by a method wherein the semiconductor device is mounted on a substrate and, after being connected to external electrodes, enclosed integrally with resin and the substrate is selectively removed by etching. CONSTITUTION:Au plating 12 of 1mum thickness, Ni plating 13 of 1mum thickness and Au plating 14 of 3mum are laminated on an Fe substrate 11 of 35mum thickness. A semiconducor chip 15 is mounted 16 on a portion 11g and connected 19 to external electrodes 17, 18 on the portions 11h, 11i. The transfer-molding with epoxy resin 20 is carried out so as to make thickness t=1mm.. The Fe substrate is removed by etching with FeCl3 solution from the back surface 11a to complete a leadless type package 21. Bottom surfaces of the Au layers are used as external electrodes 12b, 12c and the heat radiation surface 12a. In other to mount the package 21 on a printed circuit board, only the external electrodes 12b, 12c are directly soldered to a conductor pattern on the substrate. With this constitution, a package of excellent heat radiation can be manufactured automatically by an easy and simple method. |
