ELECTRONIC PART COOLING MECHANISM

摘要

PURPOSE:To perform a cooling work efficiently by a method wherein a heat dissipating member which comes in contact with the surface of an electronic part is provided on the surface of said electronic part mounted on a substrate, a heat pipe with which evaporation heat will be utilized is built-in in the heat dissipating member, and said heat dissipating member is pressed on to the electronic part using an elastic means. CONSTITUTION:A plurality of semiconductor devices 3 are adhered on the ceramic substrate 1, having a number of protruding pins 2 provided on the lower part, using a solder bump 4, and the heat dissipating member 5 whereon a radiation sleeve 12 with heat dissipating fins 13 on the circumference is contacted to each semiconductor device 3. A recessed groove is provided at the upper part of said heat dissipating member 5, a stationary block 7 is inserted into the recessed groove, a pressing plate 8 which is fixed by a bolt 9 and a nut 10 is provided on the substrate 1, and the block 7 is pressed by said pressing plate 8. Also, a cavity part is provided in the heat dissipating member 5 at the point located below a spring 6, and a heat dissipating element 11 consisting of a heat pipe with which evaporation heat is utilized and a cooling material are placed in said cavity part. Through these procedures, a vaporization process and a liquefaction process are performed repeatedly on the solution sealed in the cavity part, thereby enabling to perform an excellent cooling work efficiently.