| 摘要 |
PURPOSE:To form the interval between a pellet and a substrate into the prescribed one as well as to improve the heat dissipating property of the titled semiconductor pellet mounted body by a method wherein connecting electrodes are formed on the back side of a semiconductor pellet and on the surface of the insutalled substrate on which the semiconductor pellet will be connected, and when they are connected using connecting solder, an isolated solder wherein controlling solder is inserted is provided on the front and back sides of the substrate located between said electrodes. CONSTITUTION:Connecting electrodes 2 and 5 are formed respectively on the circumferential part on the back side of the semiconductor pellet 1 and on the surface of the insulated substrate opposing to said semiconductor pellet 1, and they are adhered with each other using a connecting solder 3. According to this constitution, a plurality of isolated electrodes 12 and 13 opposing to the back side of the pellet 1 and the upper surface of the substrate 4 are provided between electrodes 2 and 5, and controlling solder 13 is inserted between said electrodes 12 and 13. Subsequently, of the solder 3 and 13, the solder 13 is swelled out into pole shape or hand drum shape and solidified. Through these procedures, the distance between the pellet 1 and the substrate 4 is formed into the prescribed one, and a heat conducting and radiating path is generated by the isolated electrodes 12 and 13, thereby enabling to increase radiation efficiency. |
