| 摘要 |
PURPOSE:A composition that is prepared by adding an amino-substituted diphenyl sulfone, dicyandiamide and its curing agent to an epoxy resin, thus giving moldings of high heat resistance and free of voids, because of its high moldability. CONSTITUTION:The objective composition is prepared by adding (A) an amino- substituted diphenyl sulfone such as 3,3',4,4'-tetradiaminodiphenyl sulfone, preferably by 15-50pts.wt., (B) dicyandiamide and its curing accelerator, preferably by 0.2-2pts.wt., respectively, such as a compound of formula II (X, Y are H, Cl, OCH3) to (C) 100pts.wt. of an epoxy resin (preferably containing a glycidylamine type epoxy resin and a novolak type epoxy resin as essential components and further, containing 10 or more pts.wt. of the former and more than 70pts.wt. of A+B as a total.
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