| 摘要 |
PURPOSE:To reduce the number of component parts and to improve heat response, by providing plates with protruded parts, which accommodate a thin film thermistor chip, at lead-wire connecting terminals, so that the plates have a wave shape with spring property, and coating the plates with epoxy resin. CONSTITUTION:A pair of facing plate-shaped lead-wire connecting terminals 8a and 8b are fixed by a laminated plate 7 at the intermediate parts and divided into three end parts 9a, 10a, and 11a and 9b, 10b, and 11b, respectively. The central parts 10a and 10b are formed in an L shape, bent in a wave shape in the vertical direction, and provided with spring property. A heat sensitive element 3 of a thin film thermistor chip is constituted by comb shaped Au-Pt thick film electrodes 13a and 13b and Sic thin film 14 on an alumina film 14. The end parts 9a, 11a, 9b, and 11b of the lead-wire connecting terminals 8a and 8b are contacted with the alumina substrate 12. The other end parts 10a and 10b are contacted with the Au-Pt thick film electrodes 13a and 13b. The heat sensitive element 3 and the end parts of connecting terminals 8a and 8b are connected by solder. The connected parts are coated by epoxy resin. |
