| 摘要 |
PURPOSE:To improve the reliability of a probe inspection by roughing the surface to be connected to a terminal to be inspected at the prove tip. CONSTITUTION:A box 6 is screwed down on the top of a printed circuit board (probe card) 4 where a plurality of probes 3 are arranged with a screw piercing a screw hole 50 and conductor layers from on the printed circuit board 4 and the box 6 respectively are electrically connected to each other with a pin 7 called as pogo pin. As the probes 3 contact a projection electrode to be inspected of a semiconductor wafer, an electrical signal is inputted into an inspector (tester) via the pin 7, a conductor pattern 8 arranged on the box 6, a connector 9 and a signal line 11 and an inspection is made ready. The tip 31 of the probe 3 is rough on the surface 32 to contact a bump pad 21 of the semiconductor wafer 1 thereby improving the reliability of the probe inspection strikingly.
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