| 摘要 |
PURPOSE:To perform the inspection readily at a low cost, by contacting a semiconductor substrate, on which solid-state image pick-up devices are formed, with a probe terminal, projecting a test chart, and reading the output. CONSTITUTION:A semiconductor substrate 1, on the surface of which many solid-state image pick-up devices are formed, and a probe terminal 3 are relatively moved. Then, the probe terminal 3 is contacted with the solid-state image pick-up devices. Then, a test chart is projected on the semiconductor substrate 1. Thereafter, the output signals from the solid-state image pick-up devices are read through the probe terminal 3. At this time, a stage 32 is moved back and forth. Fine adjustment in the X and Y directions are performed by knobes 13 and 14. The image of the test chart 10 is formed on the surfaces of the solid- state image pick-up devices through a lens 7. Thus the semiconductor substrate can be checked before it is divided. |
