| 摘要 |
PURPOSE:To improve heat dissipating property, shock resistance and humidity resistance, by connecting a heat dissipating plate to a semiconductor chip through a mounting agent, which is a good heat conductor, and sealing the heat radiating plate by a resin mold layer 6. CONSTITUTION:In a recess part 11, which is formed by a bed part and an opening part, which pierces a polyimide resin film 122, a semiconductor chip 3 is mounted on the bed part 11 through a silver-epoxy mounting agent 2. The chip 3 and the tip part of an inner lead 51 are connected by a bonding wire 4. A heat dissipating plate 121 is further provided beneath the bed part and connected to the chip 3 through the mounting agent 2. They are sealed by a resin mold layer 6. |
