| 摘要 |
In this procedure for the manufacture of a multilayer circuit employing thin-film-technology, a separating layer (3) is vapor-deposited onto the conductor tracks (2) belonging to the first circuit level, at the points where the conductor tracks are intended to cross one another. Thereafter, the substrate areas which are not covered by conductor tracks (2) are coated by the vapor-deposition of a first filler-layer (5). In the next step, the area which is not covered by the separating layer (3) is coated with a second filler-layer (7), likewise by means of a vapor-deposition process. The application of the filler-layers (5, 7) results in a plane surface at each circuit level. Following the application of the filter-layers (5, 7), the conductor track belonging to the second level can be applied. The second level is completed in the same manner, as are further levels of the multi-layer circuit. Oxides or glasses, exhibiting high melting points, are employed as the materials for the separating layers (3) and the filler-layers (5, 7), it being possible for the separating layers and the filler-layers to be composed of the same material. The vapor-deposition operations are, in all cases, effected with the aid of suitable masks. <IMAGE> |
