SPIN CHUCK OF WAFERS AND AN ETCHER USING IT

摘要

A spin chuck and an etching device including the same are provided to prevent the contamination of a wafer and the corrosion of the spin chuck by blocking a space between a rotator and a fixture of a spin chuck. A processing chamber(510) provides a space for performing the ashing. A wafer spin chuck(550) rotates a wafer in a processing chamber. A liquid solution supply unit(530) sprays the liquid solution on a surface of the wafer. A wafer spin chuck has a rotator, a fixture, and a blocking unit. The rotator(100) rotates the wafer while floating the wafer by the inert gas. The fixture contacts the lower part of the rotator with a space. The blocking unit blocks the space.