CURE-PROCESS FOR SEMICONDUCTOR CHIP-BONDING AND CURE-OVEN APPARATUS THEROF

摘要

A curing process of a semiconductor chip bonding and a cure oven apparatus therefor are provided to supplement a heating delay of a lead frame due to a convective heat by heating the lead frame through a conductive heat. A lead frame magazine(12) receives a lead frame(10) with a chip and contacts the lead frame physically. The lead frame magazine is made of a heat conductor for heating the contacted lead frame by the conductive heat. A heating plate(16) is installed in a chamber(14) of a cure oven providing a process space to input the lead frame magazine for performing a chip bonding curing by the hot air. The heating plate or lead frame magazine is made of copper or aluminum. The lead frame magazine is contacted with the heating plate through a conduction extending surface to extend the heat contact surface in order to increase the transmission heat quantity.