| 摘要 |
PURPOSE:To spread the resin paste uniformly on the back surface of the semiconductor pellet by determining the intervals of the spread resin paste to be longer in a scrubbing direction of the semiconductor pellet and be shorter crossing the direction with the scrubbing direction at right angle. CONSTITUTION:The intervals of silver paste 21 spread on an island 12 are longer in a scrubbing direction 15 and are shorter in a crossing direction 16 with the scrubbing direction. The whole quantity of the paste to be spread is so selected that the silver paste 21 does not expand out of the semiconductor pellets. By this spreading, the semiconductor device in which the silver paste dose not expand out of the semiconductor pellets and are spread over the back surface of the semiconductor pellets uniformly, can be obtained. |
