发明名称 AUTOMATIC PLATING METHOD AND APPARATUS OF SMALL PARTS
摘要 PURPOSE:To uniformly and efficiently plate a large number of small articles, by plating articles to be plated with a plating liquid rising by centrifugal force generated by rotating a drum consisting of a suspended anode cylinder and a bottomed cathode outer cylinder while tumbling the same by a stirring member. CONSTITUTION:A drum A consisting of the anode cylinder 6 suspended from a lid body 2 and an inner surface wall 1 having an inclined bottom is vertically rotated by a motor 14. The plating liquid (b) and small articles (a) to be plated rise in the drum A by centrifugal force and said small articles (a) are plated by passing a current through both electrodes. The non-conductive stirring member provided to the leading end of the arm 12 rotated by a motor tumbles the small articles (a) rising along the inner surface wall 1 and contacted therewith under pressure to perform uniform plating while the plating completed small articles (a) are discharged to an outtake port 30 from an outtake stopcock along with the plating liquid. The plating liquid (b) is supplied from a cooling tank 26 by a pump 24 and the overflowed liquid 25 is returned to the tank 26. Because the small articles (a) is tumbled while contacted with the inner surface wall 1, they are plated uniformly in good efficiency.
申请公布号 JPS59205499(A) 申请公布日期 1984.11.21
申请号 JP19830081388 申请日期 1983.05.09
申请人 HOUJIYOU TETSUYA 发明人 HOUJIYOU TETSUYA
分类号 C25D17/22;C25D17/16 主分类号 C25D17/22
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