| 摘要 |
PURPOSE:To bring a photoelectric conversion element chip located close to an optical fiber, and to improve coupling efficiency by previously forming a protruding section to a lead frame for fixing the element chip when two lead frames to which the element chip and an IC chip constituting a peripheral circuit are fixed separately are sealed with a transparent molding body, the optical fiber opposite to the element chip are brought into contact with the surface of the molding body and an optical module is manufactured. CONSTITUTION:A lead frame 1 to which a photoelectric conversion element chip 4 for a photodiode, etc. is fastened, a frame 2 to which an IC chip 5 constituting a peripheral circuit is fixed and a frame 3 for connection are connected mutually by using wires 6, and the whole is sealed with a transparent molding body 7, thus manufacturing an optical module. In the constitution, a projecting section 8 directed to the outer surface of the molding body 7 is formed to the element- chip 4 fixing section of the frame 1, a shallow recessed section 9 is shaped to the projecting section 8, and the element chip 4 is fastened into the recessed section 9. Accordingly, a distance between an optical fiber brought into contact with the molding body 7 and the element chip 4 is shortened. |
