SEMICONDUCTOR DEVICE

摘要

PURPOSE:To facilitate the connection of the metal leads with the semiconductor element by thinning one-side ends of the leads as well as the connection with the external circuit by thickening another-side ends of the leads. CONSTITUTION:One end 25 of a metal lead 23 gilt with Sn is connected to an Au projecting electrode 22 on a semiconductor element 21 by Au-Su alloy junction and the lead 23 is stuck and fixed to the element 21 with resin 24. Furthermore, a connection terminal 27 projects from the bottom of the element 21 to contrive facility of connection with a circuit board 31. In this constitution, the semiconductor device 33 can be fitted to the board 31 easily by similar process to be applied to the general passive parts 34 such as a chip resistance and high- density mounting is attained.