| 摘要 |
PURPOSE:To obtain a device having three-dimensional mounting structure while mutually connecting semiconductor elements easily by loading the semiconductor element on a substrate, mounting an electrode terminal while one end is exposed to the edge section of the circumferential wall of the element, bonding a large number of the substrates with a heat-resisting resin and mutually connecting the exposed electrode terminals. CONSTITUTION:A semiconductor element 17 is loaded on an insulating substrate 22, the edge section of the circumferential wall of the element is surrounded by a heat-resisting resin substrate 19, a side surface thereof has an electrode conductive layer 12 and the surface thereof an electrode conductive layer 20, and the projecting section 20' of the conductive layer 20 is connected to a projecting electrode 18 for the element 17. A plurality of the substrates 22 manufactured in this manner are superposed on a ceramic and glass epoxy resin substrate 23 through spacers 24 in small width, an upper surface is coated with a base body 25, and the substrate 23 and the cover body 25 are clamped by a holding frame body 26 and fixed temporarily. Space formed by the spacers 24 is filled with an insulating adhesive resin 27 such as epoxy and the resin is cured, and the electrode conductive layers 21 exposed to the side surfaces are connected with each other, thus manufacturing a device having three-dimensional structure. |
