发明名称 RESIN SEALING DEVICE OF SEMICONDUCTOR INTEGRATED CIRCUIT ELEMENT
摘要 PURPOSE:To enable any kind of lead frame to be resin-sealed using the same plunger and tablet by a method wherein two or more resin reservoirs communicated with each other are provided in each resin sealing unit. CONSTITUTION:Four reservoirs 16a-16d with the same capacity are arranged at specified pitch. Two reservoirs 16a, 16b are connected to a resin sealing unit 15a through the intermediary of two runners 17a, 17b and a gate 19a. Likewise the other two reservoirs 16c, 16d are connected to another resin sealing unit 15b through the inter mediary of the other two runners 17c, 17d and another gate 19b. Each resin sealing unit 15a, 15b may be respectively supplied with resin from the resin reservoirs 16a, 16b or 16c, 16d respectively through the intermediary of the runners 17a, 17b or 17c, 17d.
申请公布号 JPS59204244(A) 申请公布日期 1984.11.19
申请号 JP19830079147 申请日期 1983.05.06
申请人 NIPPON DENKI KK 发明人 SHIBUYA KOUJIROU
分类号 B29C45/00;B29B7/00;B29C39/00;B29C39/10;B29C39/24;B29C39/26;B29C43/00;B29C45/02;B29C45/14;B29C61/00;H01L21/56 主分类号 B29C45/00
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