发明名称 TAPE GUIDE AT DIE PICKUP PART IN DIE BONDING DEVICE
摘要 PURPOSE:To smoothly picking up a die by securely recognizing the die on an expand tape by a method wherein a part or the whole of the guide surface including the periphery of a vacuum hole is formed of rubber. CONSTITUTION:A recess 11 of a fixed depth is formed in a fixed cylindrical range around the vacuum hole 7 at the center of the guide surface 6. A rubber sheet 13 having the same thickness as the depth of the recess 11 and a hole corresponding to the vacuum hole 7 at the center is fitted in said recess. Even when a collet 5 abuts against the die D on the guide surface 6, the impact applied on the die D at this time is absorbed to the rubber sheet 13. Since the surface of the rubber sheet 13 irregularly reflects light, an optical system recognition device can exactly discriminates the boundary between the die D and the rubber sheet 13 and can therefore accurately lead the die D to the center position of a table guide 3.
申请公布号 JPS59204247(A) 申请公布日期 1984.11.19
申请号 JP19830079039 申请日期 1983.05.04
申请人 ROOMU KK 发明人 SAKAMOTO YUUJI
分类号 H01L21/67;H01L21/00;H01L21/52;H01L21/68 主分类号 H01L21/67
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