| 摘要 |
PURPOSE:To eliminate errors on inspection and errors on printing by inspecting electric characteristics under the states in which a plurality of semiconductor devices, which are sealed with a resin on a lead frame and molded, are connected in the semiconductor devices, printing the display of characteristics and detaching the semiconductor devices from the lead frame. CONSTITUTION:Semiconductor elements 4 are die-bonded on each die pad of a lead frame 1, and wire-bonded with each lead section 3. These several element 4 section is sealed by molding resin sealing bodies 5 through a resin casting. Consequently, a plurality of semiconductor devices 6 are formed on the lead frame 1. Lead sections 2 are left as they are, and the noses of other lead sections 3 are cut from the lead frame 1 to form leads 3a. Each contact terminal 7 of an inspecting apparatus is brought into contact with several lead 3a and the common lead frame 1, and electric characteristics are inspected. The device 6, characteristics thereof are defective, is removed, and the display of characteristics is printed on others. When the noses of each lead section 2 are cut from the lead frame 1, severally separated transistors 6 are completed. |
