| 摘要 |
PURPOSE:To bond a wire positively and easily regardless of the size of the thickness, etc. of a radiator fin for a semiconductor element, on the back thereof the radiator fin is mounted in order to improve radiation property. CONSTITUTION:Support legs 6 are formed to the side edge sections of a loading section 4 loading a semiconductor element 2 in a frame formed by coating one thin conductive metallic sheet with an insulator, faying surfaces 3 are formed at the lower ends of the support legs 6, and lead circuits 5 are shaped extending over the faying surfaces 3 from the loading section 4. A radiator fin 10 is formed by expanding the back of the loading section 4 or formed on the back of the semiconductor element 2. The semiconductor element 2 is fixed to the loading section 4 of the frame 1 by high-frequency welding, high-temperature solder or conductive adhesives, and pads 8 are wire-bonded. |
