发明名称 SUPERCONDUCTING INTEGRATED CIRCUIT
摘要 PURPOSE:To shorten and simplify a manufacturing process, and to form a finer pattern by forming a thin-film resistor consisting of a resistance film composed of a metal having a thinf-film resistance pattern shaped onto a substrate, an Al film formed so as to coat the surface of the resistance film and a superconducting thin-film as a superconducting wiring brought into contact with part of the Al film. CONSTITUTION:A resistance film 12 with film thickness of approximately 500-3,000[Angstrom ] consisting of Mo is shaped onto a substrate 11, and an Al film 13 with film thickness of approximately 50-300[Angstrom ] is formed onto the resistance film 12. A mask composed of a photo-resist with a pattern for a thin-film resistor is shaped, and the Al film 13 and the resistance film 12 are patterned. A superconducting thin-film 14 with film thickness of approximately 2,000-6,000[Angstrom ] consisting of Nb or NbN or the like is formed. The superconducting thin-film 14 is patterned into a superconducting wiring.
申请公布号 JPS6216586(A) 申请公布日期 1987.01.24
申请号 JP19850155262 申请日期 1985.07.16
申请人 AGENCY OF IND SCIENCE & TECHNOL 发明人 IMAMURA TAKESHI
分类号 H01L39/22;H01L27/18;H01L39/24 主分类号 H01L39/22
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