| 发明名称 | Stud bump bonding in implantable medical devices | ||
| 摘要 | Presented herein are stud bump bonding techniques for electrically connecting an elongate conductor, such as a wire or pin, to a bonding pad. A plurality of stud bumps are bonded to a surface of a bonding pad and an elongate electrical conductor is positioned in proximity to the plurality of stud bumps. The elongate conductor is bonded to one or more of the stud bumps. | ||
| 申请公布号 | US9351436(B2) | 申请公布日期 | 2016.05.24 |
| 申请号 | US201313790141 | 申请日期 | 2013.03.08 |
| 申请人 | Cochlear Limited | 发明人 | Raje Milind;Bennett Robert;Mudie Andrew;Ignacio Gary Mark |
| 分类号 | B23K1/06;B23K26/00;H05K13/04;B23K20/00;A61N1/375;H05K3/34;H05K3/40;A61N1/36 | 主分类号 | B23K1/06 |
| 代理机构 | Edell, Shapiro & Finnan, LLC | 代理人 | Edell, Shapiro & Finnan, LLC |
| 主权项 | 1. A method comprising: bonding a plurality of stud bumps to a surface of a bonding pad of an electronics assembly positioned within a hermetically sealable implantable housing, wherein a hermetic feedthrough comprising a plurality of feedthrough pins extends through the implantable housing; positioning a first feedthrough pin in proximity to the plurality of stud bumps; and bonding the first feedthrough pin to one or more of the stud bumps. | ||
| 地址 | Macquarie University, NSW AU | ||