| 摘要 |
PURPOSE:To prevent displacement of inner lead and enhance assembling yield by placing a pellet having completed formation of element on a bed, connecting the electrode of pellet and inner lead with wire, and fixing the inner lead and bed with a polymer compound at the time of sealing a device within the case. CONSTITUTION:A polyimide resin tape 16 is attached to the surface of a bed 12 forming the lead frame and the inner lead 13a of lead 13 facing thereto. In such constitution, the tape 16 is extended from the roll for the required length and is then cut and a thermal bonding agent 17 is applied to both front and rear surfaces 16a and 16b. The tape 16 is attached from the bed 12 to inner lead 13a and it is then fixed to the tape 16 on the bed 12 while a semiconductor pellet 11 is heated. Thereafter, the electrode of pellet 11 and lead 13a are connected with a fine lead 14, the end of lead 13 is exposed and the entire part is surrounded by an external case 15. |
