| 摘要 |
PURPOSE:To easily exhaust the air in the resin by stacking the top force and bottom force having cavity for sealing semiconductor element at both upper and lower surfaces, supplying fused resin into a cylindrical pot provided at the top force and forming the tapered upper surface at the internal circumference of pot for transfer of resin into the cavity by pressing it with the plunger. CONSTITUTION:The top force 11 of metal die having the cavities 13a, 13b for sealing semiconductor element at the lower surface and the bottom force 12 having the cavities 13a, 13b corresponding to said cavities and the runners 17a, 17b through the cull 16 at the upper surface are stacked and these can be freely removed with pumps 14a and 14b which move vertically. A cylindrical pot 20 corresponding to the cull 16 is bored at the center of upper force 11 and at this time internal upper circumference of pot 20 is tapered up to the distance reaching the area indicated by B. When the resin 19 supplied into the pot 20 is pressed by the plunger 18, the air mixed in the resin 19 is easily exhausted from the gap between tapered areas. |
