INTEGRATED CIRCUIT PACKAGE PAD AND METHODS OF FORMING

摘要

A semiconductor device and a method for forming the semiconductor device are provided. The semiconductor device comprises an integrated circuit die. The integrated circuit die has through vias adjacent to the integrated circuit die. A molding compound is interposed between the integrated circuit die and the through vias. The through vias have a projection portion extending through a pattered layer. The through vias can be offset from a surface of the patterned layer. A recess can be formed by selectively removing a seed layer used to form the through vias. Therefore, an increased surface between solder and the through vias can increase reliability.