| 摘要 |
PURPOSE:To eliminate scribe of element and improve working efficiency by forming recession at the stage surface at the time of bonding and fixing semiconductor element to the die stage using a bonding agent, surrounding the periphery of it with shallow groove and filling the recession with the bonding agent. CONSTITUTION:On the occasion of bonding a semiconductor element 16 on a die stage 12 provided to the lead frame 11, a recession 12a is formed at the surface of stage 12 and a shallow groove 13 is provided in the periphery of said recession. The die stage 12 is thus formed, a holding plate 14 provided to the nozzle at the front end of syringe reservior is pressed to the recession 12a. Thereby a constant amount of conductive bonding agent 15 is discharged, filling the recession 12a. Thereafter, the semiconductor element 16 is placed on this bonding agent 15, it is fixed by bonding while the air included in the bonding agent 15 is escaped to the groove 13. Thus, thickness of bonding agent 15 is kept constant and thereafter the element 16 is sealed by resin. |
