| 摘要 |
PURPOSE:To reduce defective patterns and inaccurate wafer discriminations and to automatically control manufacturing conditions by scanning impurity concentration patterns displayed on the surface of a wafer using optical scanning means, transferring the scanning information to a control equipment and drawing out the manufacturing conditions. CONSTITUTION:Saturated aqueous solution wherein P2O3 is dissolved is dropped by a syringe-like dropping device and coated on a specified area on the surface of a silicon substrate (wafer) 1 for the manufacture of semiconductor device and an impurity concentration pattern 4 by a specified number of circles 2 is formed. The pattern 4 is made to be corresponding to a pattern in the control equipment wherein the manufacturing conditions are previously memorized. In the optical means, the pattern 4 is scanned by laser light, the wavelength of which is longer than 8mum and the scanning information of the pattern 4 is transferred to the control equipment. The manufacturing conditions are drawn out from the control equipement by means of the scanning information and defective patterns and inaccurate wafer discriminations are reduced, thus the manufacturing conditions are automatically controlled. |
