| 摘要 |
PURPOSE:To reduce the dispersion of the heat resistance of a semiconductor element by a method wherein a recessed part, whose depth is 20-50mum and whose shape is determined according to the size of the semiconductor element is formed in a semiconductor fixing island which composes a lead frame and the semiconductor element is fixed to the recessed part with solder. CONSTITUTION:A lead frame 10, made of a copper plate, has an island 11, a heat radiation plate fitting screw hole 12 drilled in the island 11 and a plurality of lead terminals 12 protruding from one end of the island 11. A recessed part 13, whose depth is 20-50mum and whose shape is a cross, a circle or a square, is drilled in the surface of the island 11, to which a semiconductor element 20 is fixed, and filled with solder 14. Then the element 20 is mounted on the solder 14 and the solder 14 is melted and solidized to fix the element 20. In order to prevent the bottom ends of the element 20 from sinking into the recessed part 13, corners of the recessed part 13 are swollen out of the diameter of the element 20 and bubbles produced in the solder 14 are discharged out from these corners. |
