| 摘要 |
<p>The flatness of a polished semiconductor wafer is improved using an appts. having a thin deformable carrier disc (5) mounted on a resilient ring(7) on a rotatable pressure plate(9). The assembly forms a chamber(41) that is connected to vacuum(37), so that the disc can be deformed into an inwardly convex shape with the wafers mounted on the concave surface. A polishing pad(19) contacting the wafers is mounted on a turntable(21) that is internally cooled to dissipate heat from the pad and turntable surface. The difference in the turntable surface temps. results in thermal bowing of the turntable towards the concave surface. The wafers are pref. mounted with wax(3) , and the turntable provides frictional drive rotation of the pressure plate assembly.</p> |
