| 发明名称 |
COVER MATERIAL FOR HERMETIC SEALING, METHOD FOR PRODUCING COVER MATERIAL FOR HERMETIC SEALING, AND ELECTRONIC COMPONENT CONTAINING PACKAGE |
| 摘要 |
This cover material for hermetic sealing (10) is configured from a cladding material (20) which comprises a silver brazing layer (21) that contains Ag and Cu and a first Fe layer (22) that is bonded onto the silver brazing layer and is configured using Fe or an Fe alloy. This cover material for hermetic sealing is formed to have a box shape by bending the cladding material, said box shape having a recess (13). |
| 申请公布号 |
WO2016104576(A1) |
申请公布日期 |
2016.06.30 |
| 申请号 |
WO2015JP85964 |
申请日期 |
2015.12.24 |
| 申请人 |
HITACHI METALS NEOMATERIAL, LTD.;HITACHI METALS, LTD. |
发明人 |
YOKOTA, MASAYUKI;YAMAMOTO, MASAHARU |
| 分类号 |
H01L23/02;B23K1/00;B23K1/20;B23K20/04;B23K101/40;H03H3/02;H03H9/02 |
主分类号 |
H01L23/02 |
| 代理机构 |
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