发明名称 |
HALOGEN-FREE PHOSPHORUS-FREE SILICON RESIN COMPOSITION, AND PREPREG, LAMINATED BOARD, COPPER-CLAD PLATE USING SAME, AND PRINTED CIRCUIT BOARD |
摘要 |
Provided are a halogen-free phosphorus-free silicon resin composition, and prepreg and laminated board using the same, and printed circuit board, the silicon resin composition comprising the following components in parts by solid weight: 50-90 parts of an organic silicon resin, 20-80 parts of a vinyl-terminated silicon oil, 0.1-5 parts of a viscosity enhancing agent, 0-60 parts of a filler, 0.0001-0.5 parts of a catalyst, and 0.00001-0.1 parts of an inhibitor, a mole ratio between Si-H in a cross-linking agent and Si-Vi in the organic silicon resin being 1.0-1.7. The resin body of the resin composition is a thermosetting silicon resin, and the laminated board prepared thereby has good heat and flame resistance and an extremely low dielectric constant (Dk) and dielectric loss (Df). |
申请公布号 |
WO2016101588(A1) |
申请公布日期 |
2016.06.30 |
申请号 |
WO2015CN83407 |
申请日期 |
2015.07.06 |
申请人 |
SHENGYI TECHNOLOGY CO., LTD. |
发明人 |
SU, XIAOSHENG;YE, SUWEN;TANG, GUOFANG |
分类号 |
C08L83/07;B32B15/08;B32B27/04;C08J3/09;C08L83/05;H05K1/03 |
主分类号 |
C08L83/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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