| 摘要 |
PURPOSE:To improve the adhesive strength of a film formed by striking on a material with inferior suitability to electrodeposition by forming a film at a high current density in a short time in the early stage of striking and by carrying out striking at a low current density for a prescribed time. CONSTITUTION:When a metal with inferior suitability to electrodeposition such as Rh is subjected to Au striking, Au striking is carried out on Rh at >=3A/ dm<2> high current density for a short time, and the striking is continued at about 0.2A/dm<2> low current density. The resulting Au layer is electroplated with Au by a conventional method to form an Au layer. Since the under Au layer with superior adhesive strength is formed even on Rh with inferior suitability to electrodeposition, the upper Au layer is not stripped from Rh.
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