发明名称 PARTIAL SEALING METHOD
摘要 PURPOSE:To obtain the arbitrary and minute complicate form of a protective layer in response to a circuit by printing and forming a pattern of a weir by using prining ink into which expandable particulates are mixed, injecting a resin to a section surrounded by the weir and shaping the protective layer. CONSTITUTION:A pattern 10 afterwards functioning as a weir is printed and formed on a substrate 1, to which wirings 3 are wired, through a screen printing method by using expandable printing ink, and an IC chip 2 is die-bonded similarly on the substrate 1 with adhesives 7. When the substrate to which the weir pattern is printed and formed is heated and treated, printed expandable ink foams and expands, height increases, and 10a is shaped. Adhesives 7 bonding the IC chip 2 cure simultaneously. The IC chip 2 and the wirings 3 on the substrate are connected 4 through wire bonding. A resin for shaping a protective layer 5 is injected to the weir 10a formed by the foaming and expansion of expandable ink, and the weir section is sealed completely.
申请公布号 JPS59200426(A) 申请公布日期 1984.11.13
申请号 JP19830074542 申请日期 1983.04.27
申请人 COPAL KK 发明人 YOSHIHARA TOSHIO
分类号 H01L23/28;H01L21/56 主分类号 H01L23/28
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