发明名称 VERTICAL MEMORY DEVICES AND METHODS OF MANUFACTURING THE SAME
摘要 A vertical memory device includes a first common source line contact plug which has an inside wall of limiting a recess region in an opening part for a common source line. A method of manufacturing a vertical memory device includes providing a substrate which includes a cell region and a peripheral region; forming a mold structure in the cell region; penetrating the mold structure, and forming an opening part for the common source line which is extended in a first direction vertical to the upper surface of the substrate; forming a first contact plug which has the inside wall of limiting the recess region in the opening part for the common source line; and forming a common source bit line contact which can be electrically connected to the inside wall of the first contact plug. So, the reliability of the vertical memory device can be improved.
申请公布号 KR20160087691(A) 申请公布日期 2016.07.22
申请号 KR20150006980 申请日期 2015.01.14
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK, SANG YONG;RHO, KEE JEONG;PARK, HYEONG;LIM, TAE WAN
分类号 H01L27/115;H01L29/788 主分类号 H01L27/115
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