| 摘要 |
<p>PURPOSE:To apply the titled device to the use such as the I-O of a microcomputer, thus simplify external wiring by reducing the number of terminals, and miniaturize the package size by using a double transfer molding system. CONSTITUTION:A common lead frame 12 is provided, and all the connections by means of Au wires 9 are performed to said lead frame 12. Lead frames 2 and 12 are both bent in the transverse direction as illustrated. Such lead frames are formed on the secondary side as well as on the primary side and thereafter arranged in opposition. The secondary side is provided with a common lead frame 13, and all the connections by means of Au wires 10 are performed to said lead frame. The common lead frames 12 and 13 and further the primary and secondary side frames including dummy leads 14 and 15 (the numeral 15 represents the secondary side dummy lead) accompanying common leads are made opposed to each other. Then transfer molding is performed to connect four pairs of light emitting and receiving parts each in optical manner and thus form a light path which can optically cut off them from other light emitting receiving parts.</p> |
