发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND USING METHOD THEREOF
摘要 PURPOSE:To obtain a compsn. having high sensitivity and definition and high resistance to dry etching by using the compsn. consisting of a specific siloxane polymer and a bis-azide compd. CONSTITUTION:A compsn. consisting of the chloromethylated polydiphenyl siloxane expressed by the general formula I , the bis-azide compd. such as, for example, 3,3'-dichloro-4,4'-diazide diphenyl methan, 4,4'-diazide diphenyl ketone, etc. expressed by the general formula II, and a sensitizing agent is used as a photosensitive compsn. Said compsn. is coated on a base plate or is coated on a base plate on which a film of an org. high polymer material is formed. After the coating is heat-treated, light is irradiated thereto to crosslink only the irradiated part. The coating is then developed with a developing soln. to form a pattern. The underlying high polymer layer is removed by dry etching using oxygen with the crosslinked part as a mask in the case of having the org. high polymer material layer.
申请公布号 JPS59198446(A) 申请公布日期 1984.11.10
申请号 JP19830072163 申请日期 1983.04.26
申请人 NIPPON DENSHIN DENWA KOSHA 发明人 MORITA MASAO;IMAMURA SABUROU;TAMAMURA TOSHIAKI;KOGURE OSAMU
分类号 G03F7/008;G03F7/075;G03F7/26 主分类号 G03F7/008
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