| 摘要 |
PURPOSE:To improve the space factor, etc. and contrive to suffice two power sources by internal connection by a method wherein the semiconductor substrates of a plurality of semiconductor chips whose polarities of operating voltage are different are insulated from each other and thus molded in an integral body. CONSTITUTION:The semiconductor chip 4 of a bi-polar type ECL circuit and that 5 of a C-MOS type PLL circuit are adhered on mounting parts 2 and 3 of a lead frame 1 formed by punching out a metallic plate, respectively, thus performing wire bonding between each of the semiconductor chips 4 and 5 and wire bonding from each electrode to the corresponding lead part 6. At this time, the mounting part 2 is connected to VSS of the semiconductor chip 5 in order to connect the semiconductor substrate of said chip 4 to VSS of said chip 5. While, VCC of said chip 4 is connected to the mounting part 3 in order to connect VCC to the semiconductor substrate of said chip 5. Thereafter, they are integrally molded with resin, and the part of broken lines is cut, thereby fixing said chips 4 and 5 on the mounting parts 2 and 3 insulated from each other. |
