| 摘要 |
PURPOSE:To enable to prevent the decrease of photo reaching rate due to the generation of refraction in a gap by a method wherein a transparent spacer having optical properties almost equal to those of a substrate is interposed in the gap produced between a photo receiving element mounted by flip chip system and the transparent substrate. CONSTITUTION:Before fixing the bump electrodes 4 of a photo receiving element 1 to the conductor parts 5 of a glass substrate 2, one surface of a transparent film 8 having a square shape slightly larger than a photosensitive part 3 is put in close contact with said part 3, and at the same time with fixing said electrodes 4 the other surface of said film 8 is brought in close contact with the surface of the glass substrate 2. If a material having optical properties almost equal to those of the material of the substrate 2 is chosen for this transparent film 8, the incident light 6 reaches said part 3 with a high efficiency without refracting between the substrate 2 and said part 3 of the photo receiving element. |
